| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_036083de070865ce9777b3a229820fa2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d18479fa47b025c3b6f1014a83d3550b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3b9d4939fd6805c39df8dd0c44ba33b0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-176 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-225 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22 |
| filingDate |
2020-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_262dd587c6eb4bd4e69490c99aab00d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b68dc8a58b1719bd8c1d1d28e74597a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ef5dbe8e5a19c9132432670fab268c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f27685f0dde26e8371181699f7780d9d |
| publicationDate |
2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-111601464-A |
| titleOfInvention |
A post-processing method for small pcs with component characters |
| abstract |
The invention provides a post-processing method for small pcs with component characters, which includes the following steps: S1. Laser out a jig slot to fix the small pcs board to be reworked; S2. The upper limit of the height of the laser nozzle is 8 mm, and the printing effect is confirmed; S3. When the side with the components is facing down, the thickness of the fixture is the maximum thickness of the components. When the components are up, the thickness of the fixture has no effect. The laser-printed pcs shape slot can be fixed. The method of the invention can solve the rework of the small pcs characters of the PCB board with components, avoid the defects caused in the production process of the PCB board, and lead to the scrapping of the whole board after the attachment, and reduce the cost loss. |
| priorityDate |
2020-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |