| abstract |
The invention discloses a low thermal conductivity polyimide foam material and a preparation method thereof. The method comprises the following steps: mixing aromatic dianhydride and polar solvent, dissolving under heating conditions, adding low molecular weight alcohol and heating continuously The esterification reaction of each component is carried out to obtain an esterification precursor solution; then a catalyst, a foaming agent, a surfactant, a polymer polyol, and a foaming agent are added and uniformly dispersed to obtain a foaming white material, and finally the isocyanate is added. Add in the white material, stir quickly to make it evenly dispersed, and then put it into a mold for foaming molding, and after it stops foaming, it is heated and cured to obtain a polyimide foam material; the polyimide prepared by the method of the present invention is obtained. Foam materials have the advantages of low thermal conductivity, high limiting oxygen index, good flame retardancy, uniform cell size, controllable density, and high mechanical strength, and can be widely used in aerospace, military ships, building insulation, vehicle construction and other fields . |