http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111590241-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34f7712637222eeb68a96ec4fc9f413e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_399bc8c4f953f8fff812875aaa4bdada http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee1ae764ce154d308ee8658f5138fef3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d67dfefb0fc112899e91f14d7d86702d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c87f73e97fd45bf0848b50a565faa6aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70e983f23ce8903a6abdbd0ad7431cb0 |
| publicationDate | 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111590241-A |
| titleOfInvention | Low temperature environment-friendly multi-alloy solder paste and preparation method thereof |
| abstract | The invention discloses a low-temperature environment-friendly multi-component alloy solder paste, which comprises the following raw materials in parts by mass: 85-90 parts of tin alloy solder and 10-15 parts of flux; the tin alloy solder contains 25-45 wt% of Bi , containing 0.5wt% to 2.5wt% of low melting point metal and Sn-Bi alloy with the balance of Sn; the flux comprises 28% to 40% of rosin, 5% to 16% of thixotropic agent, 6% to 8% of surfactant, 3% to 6% of organic active substance and the balance of organic solvent. The Bi content in the tin alloy solder is reduced to 25wt% to 45wt% of the tin alloy solder, so as to improve and reduce the brittleness of the Sn-Bi alloy, improve the plasticity of the solder, and solve the problem of the brittleness of the existing solder paste containing the Sn-Bi solder alloy. The problem of the potential risk caused by the large; taking advantage of the fact that the melting point of most alloys is lower than the melting point of any of the constituent metals, the tin alloy solder is made by adding an alloy of low melting point metal mixed with Sn and Bi to make tin The solder joint temperature of the alloy solder is reduced, while the wetting properties of the solder are enhanced. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115401356-A |
| priorityDate | 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.