Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c28d4ea320b90ed19f8de42eb1428cc8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-16 |
filingDate |
2018-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6036bda9882156451b7721656ee84c39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ce32c7a72ad450a3d04ac8a049dad50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54a628e7ad0c0ed9b8e4b18114dd46bb |
publicationDate |
2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-111565859-A |
titleOfInvention |
Surface treatment composition and method |
abstract |
The present disclosure relates to methods and compositions for processing wafers having patterns disposed on the surface of the wafer. |
priorityDate |
2018-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |