http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111534259-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate | 2020-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111534259-B |
| titleOfInvention | Moisture-resistant low-temperature-curing epoxy adhesive and preparation method thereof |
| abstract | The invention discloses a moisture-proof low-temperature curing epoxy adhesive which comprises the following components in parts by weight: epoxy resin: 20-50 parts of rubber particle modified epoxy resin: 10-30 parts of organic silicon modified epoxy resin: 1-20 parts of stabilizer: 0.1-1 part of curing agent: 10-50 parts of coupling agent: 0.1-1 part of thixotropic agent: 0.1-0.5 part of accelerator: 1-20 parts; the synthesis method of the organic silicon modified epoxy resin comprises the following steps: heating E51 epoxy resin and phenyl organic silicon resin containing silicon hydroxyl to 110-130 ℃; adding dibutyltin dilaurate and keeping the temperature to react for 1.5-3.5 h. The invention also discloses a preparation method of the adhesive. The invention improves the water resistance from two aspects of matrix resin and curing agent, so that the glue has high moisture resistance while having quick curing. |
| priorityDate | 2020-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.