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filingDate 2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-111511103-A
titleOfInvention Low-overhang component carrier with through-holes of different sizes for front and rear side windows
abstract A component carrier (100) comprising: an electrically insulating layer structure (102) having a front side (104) and a back side (106); a first conductive layer structure (108), the first conductive layer structure covering the front side (104) of the electrically insulating layer structure (102); a second conductive layer structure (110) covering the back side (106) of the electrically insulating layer structure (102); and through holes (112), the via extends through the first window (114) of the first conductive layer structure (108), the electrically insulating layer structure (102) and the second window (110) of the second conductive layer structure (110). 116); wherein the width (118) of the second window (116) is smaller than the width (120) of the first window (114); and wherein the first conductive layer structure (108) and the second conductive layer structure At least one of (110) does not exceed an overhang (122) of the electrically insulating layer structure (102) that delimits at least one sidewall (124) of the via (112) by no more than 10 μm.
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