http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111500892-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-1052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-1036 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C26-00 |
| filingDate | 2020-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111500892-B |
| titleOfInvention | Preparation method of large-sized flake-shaped ultra-high thermal conductivity diamond/copper composites |
| abstract | The invention discloses a preparation method of a large-size flake-shaped ultra-high thermal conductivity diamond/copper composite material, and relates to a preparation method of a diamond/copper composite material. The purpose is to solve the problems of low thermal conductivity and poor interfacial bonding strength of diamond/copper composites. Method: Fill the diamond particles coated with metal film into the cavity of the graphite mold to obtain a preform; place the preform in a crucible, place the bulk pure copper and copper alloy on the upper part of the preform in the crucible, and place the preform under air pressure. In the impregnation furnace, the structure and morphology of the interface layer material are controlled under the protective atmosphere of argon, the temperature is raised to melt the copper, the heat preservation and pressure-holding infiltration are carried out, and finally the pressure-holding step cooling is carried out. The volume fraction of diamond in the obtained composite material component is 60%-85%, the thermal conductivity reaches 1500W/mK, the side length reaches 60-130mm, and the thickness reaches 0.2-4mm. The invention is suitable for preparing high thermal conductivity diamond/copper composite material. |
| priorityDate | 2020-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.