| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_beaff8169965bd7b4d7b6e35d6701a9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54426 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2019-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd74b3d600028d73322edc092dfe1d98 |
| publicationDate |
2020-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-111490008-A |
| titleOfInvention |
Backside metal patterned die dicing system and related methods |
| abstract |
The present invention is entitled "Backside Metal Patterned Die Saw System and Related Methods." Embodiments of a method of dicing a plurality of dies included in a substrate may include: forming a plurality of dies on a first side of the substrate; forming a backside metal layer on a second side of the substrate; and forming a backside metal layer on the backside metal layer A polymer layer is applied thereover; and a trench is formed completely through the polymer layer and partially through a thickness of the backside metal layer. The trenches may be located in the die tracks of the substrate. The method may also include: etching through the remainder of the backside metal layer located in the die lane; removing the polymer layer; and dicing the plurality of dies in the substrate by removing substrate material in the die lane. |
| priorityDate |
2019-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |