http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111463187-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate | 2020-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111463187-B |
| titleOfInvention | Flexible device based on system-in-package and manufacturing method thereof |
| abstract | The present disclosure relates to a system-in-package based flexible device and a method of manufacturing the same. The device sequentially comprises a bottom substrate, a middle substrate and a packaging layer from bottom to top, wherein a bottom wire is arranged on the bottom substrate; the middle layer substrate is provided with a middle layer lead, a functional chip with pins connected with a bottom layer chip lead in the bottom layer lead is arranged in a chip mounting position on the middle layer substrate in an inverted mode, and an interlayer connecting lead used for connecting the middle layer lead and the bottom layer lead is arranged in a lead through hole on the middle layer substrate; the packaging layer is used for packaging the device, and a passive device with a pin connected with a passive device wire in the middle layer wire is arranged in a device groove on the packaging layer; the packaging layer is provided with a top pin and is connected with the middle layer wire through a pin connecting wire arranged in the pin wire through hole. The device and the method provided by the embodiment of the disclosure have the advantages of simple manufacturing process, good ductility and flexibility of the device, small size of the device, good reliability and better performance; the application range is wide. |
| priorityDate | 2020-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.