| abstract |
The present invention provides a semiconductor device, a method for forming the same, and a chip. A method for forming a semiconductor device, comprising: providing a first wafer and a second wafer; bonding the first wafer and the second wafer, the first interconnect metal layer facing the second interconnect metal layer bonding; forming an isolation layer, the isolation layer at least covers the part of the first interconnect metal layer and the second interconnect metal layer on the bonding interface exposed by the other after the first interconnect metal layer is in contact, so as to prevent metal diffusion, Effectively prevent leakage, improve the electrical performance and quality reliability of semiconductor devices. |