| abstract |
The invention relates to a resin composition comprising a mixed resin, a modified filler and a curing agent. The mixed resin includes a first resin and a second resin, the first resin is a vinyl thermosetting resin, and the second resin is a resin capable of mixing with the first resin. The reacted copolymer, the modified filler is the surface of the filler modified by the third resin, and the third resin is a copolymer capable of reacting with the first resin. The invention also relates to a prepreg, a circuit substrate and a printed circuit board. In the present invention, the selection of the mixed resin in the resin composition and the modification, selection and particle size control of the filler enable the obtained circuit substrate to take into account the effects of dielectric constant, dielectric loss, processability and PIM at the same time. |