http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111424296-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04 |
| filingDate | 2020-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111424296-B |
| titleOfInvention | Electroplating copper solution and electroplating method for filling through hole of IC carrier board |
| abstract | The invention discloses an electroplating copper solution for filling through holes of an IC carrier board and an electroplating method. The electroplating copper solution includes the following components according to the concentration: copper methanesulfonate: 180-240g/L, methanesulfonic acid: 40-70g /L, chloride ion: 30-50mg/L, 3-mercapto-1-sodium propanesulfonate (MPS): 2-5mg/L, sodium dihexyl succinate: 40-100mg/L, chloride Nitrotetrazolium blue (NTBC): 100-180mg/L, DI pure water: balance. The above-mentioned components are uniformly mixed to form the copper electroplating solution filling the through holes of the IC carrier board; during the electroplating process, the copper electroplating solution makes the copper metal inside the through holes of the IC carrier board preferentially deposited to the center of the through holes to form a butterfly shape, thereby forming a butterfly shape. Filling two blind holes can prevent the formation of voids; and the electroplating solution can completely fill through holes with a hole depth of 300um, a diameter of 130um, and a middle width of 90um, and the surface copper thickness is only 8.5um. |
| priorityDate | 2020-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.