http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111423588-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2020-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111423588-B |
| titleOfInvention | Single-end-capped propionyloxy organic silicon resin, preparation method thereof, conductive adhesive containing organic silicon resin and preparation method thereof |
| abstract | The invention discloses a single-end-capped propionyloxy organic silicon resin and a preparation method thereof, and a conductive adhesive containing the organic silicon resin and a preparation method thereof, wherein the structural formula of the single-end-capped propionyloxy organic silicon resin is shown as a formula (I), and the conductive adhesive comprises 10-30 parts of the single-end-capped propionyloxy organic silicon resin and also comprises the following raw materials in parts by weight: 0.5-5 parts of thermal initiator, 1-5 parts of thermoplastic powder filler, 60-80 parts of modified silver powder, 1-10 parts of solvent and 0.1-1 part of stabilizer; wherein the weight part of the singly-terminated propionyloxy organic silicon resin is 10-30 parts. The conductive adhesive disclosed by the invention has excellent elongation, bonding strength, conductivity, flexibility and drop resistance of a cured product, and can be widely applied to the electronic industry. |
| priorityDate | 2020-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.