| abstract |
The invention provides a release film for a layered capacitor. The preparation raw materials include: 8-12 parts of silicone oil, 70-85 parts of solvent, 0.5-1.5 parts of catalyst, 1-2.5 parts of anchoring agent, 5-8 parts of lubricant, 1-7 parts of organic glue, 0.2-0.7 parts of organic glue curing agent, 1-7 parts of inorganic glue, 0.2-0.7 parts of inorganic glue curing agent, 3-5 parts of spreading agent, organic glue is selected from alkyl phenol formaldehyde resin, meta- At least one of diphenol formaldehyde resin and thermosetting alkyl phenolic resin, organic glue curing agent is selected from at least one of paraformaldehyde or hexamethylenetetramine, and inorganic glue is selected from nano copper oxide-phosphoric acid inorganic glue or Aluminum dihydrogen phosphate inorganic glue, inorganic glue curing agent is selected from the mixture of nano-zirconia and nano-zinc oxide. The release film has excellent high temperature resistance and smoothness, which can prevent it from being scratched, scratched and deformed by heat. The present invention also provides a preparation method of the above-mentioned release film for a layered chip capacitor. |