http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111363508-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1f923ae43d87e1ddb6aa57eaf169720
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
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filingDate 2020-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09fec3df8ebc8f8da2a67217630a5e76
publicationDate 2020-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-111363508-A
titleOfInvention A kind of conductive adhesive and preparation method thereof
abstract The embodiment of the invention discloses a conductive adhesive and a preparation method thereof, and belongs to the technical field of conductive adhesives. The conductive adhesive comprises: carbon-based filler, 1-10 parts by weight; epoxy resin, 30-50 parts by weight; phenolic resin, 20-30 parts by weight; polyisocyanate, 6-13 parts by weight; polyol compound, 1.5-8 parts by weight parts by weight; curing agent, 1-20 parts by weight; organic solvent, 10-20 parts by weight; chain extender, 3-7 parts by weight; dispersant, 1.5-8 parts by weight. The conductive adhesive and the preparation method thereof provided by the embodiments of the present invention can greatly improve the thermal conductivity of the conductive adhesive while satisfying the high electrical conductivity required for the conductive adhesive, which is helpful for improving the reliability of the conductive adhesive in the field of microelectronics. nature and duration of use.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112126195-A
priorityDate 2020-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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