| abstract |
The invention relates to an epoxy-modified low-dielectric fluorine-containing polyphenylene ether coating and a high-frequency and high-speed copper clad laminate prepared therefrom, characterized in that the epoxy-modified low-dielectric fluorine-containing polyphenylene ether coating comprises low molecular weight Fluoropolyphenylene ether structure epoxy resin, epoxy resin, diluent, curing agent, toughening agent, accelerator, flame retardant, silane coupling agent, filler and solvent A. The high-frequency and high-speed copper clad laminate prepared by the epoxy modified low-dielectric fluorine-containing polyphenylene ether coating provided by the present invention has the characteristics of low dielectric, high Tg, ultra-low shrinkage, low water absorption and easy processing, and can be used for 5G circuit board field. |