| abstract |
A subassembly includes a glass substrate, a plurality of electronic devices, and passivation layers. The glass substrate includes a first surface, a second surface opposite the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. A passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes openings to each of the plurality of laser damaged regions. |