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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-08
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filingDate 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-111334226-B
titleOfInvention Heat-conducting adhesive with low glass transition temperature and preparation method thereof
abstract The invention belongs to the technical field of heat-conducting glue, and discloses heat-conducting glue with low glass transition temperature and a preparation method thereof, wherein the heat-conducting glue consists of two components, and through the combination of synthesized high-performance prepolymer and nano-grade high-heat-conducting material, the curing shrinkage rate, the glass transition temperature, the heat conductivity coefficient, the viscosity and the like of the heat-conducting glue are effectively improved, the adjustability of curing time is realized, and a volatile organic solvent is avoided; and the adhesive is also suitable for mobile phones, radiators, high-power electronic components, circuit board heat dissipation, bonding and filling of electrical modules and radiators and the like.
priorityDate 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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