| abstract |
An apparatus for manufacturing a semiconductor device includes: a process chamber including a plasma processing space; and a substrate support disposed in the process chamber and configured to support a substrate, wherein the substrate support comprises: a base including a plurality of lift pin holes, each lift pin hole configured to receive a lift pin; and a sealing band having an annular shape and protruding from the base, the sealing band having an inner diameter less than a pitch circle diameter of the plurality of lift pin holes. |