| abstract |
To provide a photosensitive resin composition as a resin composition that can obtain a cured product with a further reduced dielectric constant and dielectric loss tangent, a method for producing a cured relief pattern using the photosensitive resin composition, and a cured relief pattern provided with the same of semiconductor devices. A negative photosensitive resin composition comprising: (A) 100 parts by mass of a polyimide precursor having a specific unit structure; and (B) 0.1 to 20 parts by mass of a radical-type photopolymerization initiator . |