http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111312661-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6aeebb5d07fb74dbd712904e7c2e9ee |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate | 2020-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9a58f2bd32cb852dc7263bd4155690a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_460e7d8555852fd434593b9d212d1728 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eff05b3c7725d7f51e0a958b07a2b28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9010d598da1001fb61ff002f96d69ce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a91c6bf33076397f82e5930b7482bad1 |
| publicationDate | 2020-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111312661-A |
| titleOfInvention | Use stress-reducing sandwich structure that ceramic substrate is last to enclose frame |
| abstract | The invention discloses a stress-reducing sandwich structure enclosure frame applied to a ceramic substrate in the field of ceramic substrate sealing, wherein a cover plate is fused above the enclosure frame, the enclosure frame comprises a welding layer and a sealing layer which are arranged up and down and are used for being matched with the thermal stress of the ceramic substrate, a stress absorbing layer is arranged between the welding layer and the sealing layer, the welding layer, the sealing layer and the stress absorbing layer are connected through welding, and a metal material with the shearing modulus of 30-50 Gpa is adopted as a stress absorbing layer 7. The invention can greatly reduce the impact of heat of the ceramic integrated shell on the ceramic substrate during parallel seam welding, improve the reliability of the ceramic integrated packaging shell and meet the high-reliability application requirement of the satellite-borne TR component. |
| priorityDate | 2020-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.