http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111295468-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09B17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2018-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111295468-B |
| titleOfInvention | Electroplating composition for electrolytic copper deposition, use thereof, and method for electrolytic deposition of a copper or copper alloy layer on at least one surface of a substrate |
| abstract | The present invention relates to electroplating compositions for electrolytic copper deposition comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethylenediamine derivative. The present invention also relates to the use of the above-described electroplating composition and to a method of electrolytically depositing a copper or copper alloy layer on at least one surface of a substrate. |
| priorityDate | 2017-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 261.