http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111293078-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2020-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111293078-B |
| titleOfInvention | Method for embedding chip into cavities on front surface and back surface of adapter plate |
| abstract | The invention discloses a method for embedding chips into cavities on the front side and the back side of an adapter plate, which comprises the following steps: the adapter plate is made of a silicon wafer with double SOI layers, a silicon through hole is manufactured, the silicon through hole penetrates through the first layer of SOI layer and stops on the second layer of SOI layer, the silicon wafer with the silicon through hole is obtained, then metal is electroplated to fill the silicon through hole, and the silicon wafer with the metal is obtained; then etching a groove on the opening surface of the silicon through hole, etching the metal column in the groove, and forming a cavity on the front side and the back side to obtain the adapter plate with the grooves on the two sides; embedding a chip with soldering tin, then manufacturing an RDL interconnection layer on the surface, continuously etching a second SOI layer to expose one end of a metal column in the filled silicon through hole, embedding the chip with the soldering tin ball, solidifying the filled colloid, and removing the surface colloid. According to the invention, the adapter plate is manufactured, the front surface and the back surface of the adapter plate are both provided with the grooves, and then the chips are embedded into the grooves, so that the purpose of embedding the chips into the front surface and the back surface of the adapter plate is realized. |
| priorityDate | 2020-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.