http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111278882-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7007b2d8585f9139b339e14a26a83854 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D265-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4562fec9388a53e2c01edf579cccbcd5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18e72bcc2306712f5e8f35977a35619c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb5f98860878061b3b71c007b1729677 |
| publicationDate | 2020-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111278882-A |
| titleOfInvention | Cured resin composition, cured product of the composition, production method of the composition and cured product, and semiconductor device |
| abstract | An object of the present invention is to provide a cured resin composition for obtaining a cured product having both high heat resistance and high mechanical strength, a cured product thereof, and a method for producing the cured resin composition and the cured product. In addition, there is provided a semiconductor device using the above-mentioned cured product as a sealing material. The present invention is a composition for a cured resin containing (A) two or more benzos, a cured resin composition thereof, and a method for producing the cured resin composition, and a cured product thereof. Polyfunctional benzos of the oxazine ring An azine compound, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, (D) a curing agent, optionally containing (E) an inorganic filler , (F) curing accelerator. Moreover, it is a semiconductor device provided with a semiconductor element in the hardened|cured material obtained by hardening the cured resin composition containing components (A)-(D) and containing (E) and (F) arbitrarily. |
| priorityDate | 2017-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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