http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111234753-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2020-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111234753-B |
| titleOfInvention | Adhesive composition with high glass transition temperature and application thereof |
| abstract | The invention discloses an adhesive composition with high glass transition temperature, wherein the glass transition temperature of a condensate of the adhesive composition is more than 180 ℃. The adhesive composition comprises the following components in parts by weight: 30-60 parts of core-shell rubber modified polyfunctional epoxy resin, 10-30 parts of epoxy resin, 4-12 parts of curing agent, 0.2-0.8 part of imidazole accelerator, 0.1-0.5 part of silane coupling agent or titanate coupling agent, 0-20 parts of filler and 70-100 parts of solvent. The nano core-shell rubber modified polyfunctional epoxy resin adopted by the scheme is used as one of main components, the toughness of the adhesive is improved, the glass transition temperature of the adhesive composition is basically not influenced, and the high-heat-resistant epoxy resin and the curing agent are matched, so that the adhesive composition with extremely high glass transition temperature and high performance is obtained, and the problems of poor heat resistance, dimensional stability and reliability of the conventional FPC multi-layer board adhesive film can be solved by the prepared pure adhesive film. |
| priorityDate | 2020-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.