http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111216294-A

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filingDate 2020-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1d3f5f0626eb9a4eecd1aa465ceae86
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publicationDate 2020-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-111216294-A
titleOfInvention A sensor package protection method, mold and sensor
abstract The present disclosure provides a sensor packaging and protection method, a mold and a sensor. A plurality of gasket brackets are arranged on the outside of the sensor along the axial direction; at least one layer of protective sleeves is sleeved on the outer side of the sensor on which the gasket brackets are arranged; the two ends of the sensor are respectively A cap plug with a hole in the middle is provided, and the side of the cap plug is provided with a packaging material injection hole and/or an outflow hole, and the cap plug can be connected with the end of the protective sleeve located in the inner layer to achieve sealing; injecting from the injection hole The viscous flow state packaging material is cured and formed to complete the sensor packaging; after the packaging is completed, the cap plugs and protective sleeves at both ends can be removed. The present disclosure can avoid the situation that the force is not uniform in all directions during the service of the sensor, and at the same time effectively avoid the disadvantage that the wires are weak around.
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priorityDate 2020-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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