| abstract |
A method comprising: polishing a semiconductor substrate of a first die to expose a first via extending into the semiconductor substrate, forming a first dielectric layer on the semiconductor substrate, and forming a dielectric layer on the dielectric A plurality of bond pads are formed in the electrical layer. The plurality of bond pads include active bond pads and dummy bond pads. The active bond pad is electrically coupled to the first via. The first die is bonded to a second die, and the active bond pads and the dummy bond pads are each bonded to corresponding bond pads in the second die. Embodiments of the invention relate to methods of forming packages, and packages of integrated circuit devices. |