http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111130485-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3fd4a8c923e4c840ad8670785398b8b1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2003-023 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-0523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 |
| filingDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111130485-A |
| titleOfInvention | Method for encapsulating electronic components in packages with organic back ends |
| abstract | A method for fabricating an array of front ends for encapsulated electronic assemblies, each of the electronic assemblies comprising, an electronic assembly encapsulated within a package, including a front portion of the encapsulation, including an interior a portion, the inner portion having a cavity therein opposite a resonator, the resonator being defined by a raised frame, the front portion of the package further comprising an outer portion sealing the cavity; and a back portion of the package including, a back cavity in the inner back portion, and an outer back portion, the outer back portion sealing the cavity, the back portion of the package further comprising a first through hole and a second through hole a hole, said first through hole and second through hole around at least one of the back cavity, and passing through the back end, to connect to the front electrode and the back electrode of the electronic component; the through hole terminates in External contact pads that can be connected to the circuit board in a "flip chip" fashion. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111769814-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111865257-A |
| priorityDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.