| abstract |
The present invention provides chemical mechanical planarization (CMP) compositions for shallow trench isolation (STI) applications. The CMP composition comprises ceria-coated inorganic oxide particles as abrasives, such as ceria-coated silica particles; a chemical additive selected from the group consisting of: containing acetylenic bonds and having at least two or more terminal hydroxyl groups ethoxylate-functional organic acetylenic molecules, organic molecules having at least two or more hydroxyl functional groups in the same molecule, and combinations thereof; water-soluble solvents; and optionally, biocides and pH adjusters; wherein The pH of the composition is 2 to 12, preferably 3 to 10, and more preferably 4 to 9. |