http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111106102-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_06dc1e191cf26ac735dd1c16edc6cba3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21Y115-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K9-90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-54 |
| filingDate | 2020-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0066de7dc4b0a083e3583194479ece68 |
| publicationDate | 2020-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111106102-A |
| titleOfInvention | Novel LED light source structure and manufacturing method thereof |
| abstract | The invention discloses a novel LED light source structure and a manufacturing method thereof, wherein the novel LED light source structure comprises: the LED light source comprises silver-plated copper columns, a built-in circuit substrate, an LED flip chip, a fluorescent layer, silica gel and a plastic casing with a built-in circuit structure; the outer side of the cylinder at the upper end of the silver-plated copper cylinder is provided with a plurality of planes, each plane is uniformly coated with high-temperature tin paste, and the built-in circuit substrate is attached to the plane of the cylinder and is fixedly connected and conducted through a high-temperature reflow soldering process; the built-in circuit substrate is coated with a first low-temperature tin paste and a second low-temperature tin paste at the two ends of the positive electrode and the negative electrode respectively, the positive electrode and the negative electrode of the LED flip chip are contacted with the first low-temperature tin paste and the second low-temperature tin paste respectively, and are fixedly connected and conducted through a low-temperature reflow soldering process; fluorescent layers are formed on the surfaces of the LED flip chips through a powder spraying or fluorescent film pasting process, and the plastic sleeve shells with the built-in circuit structures are sleeved on the built-in circuit substrates on all planes of the columns to enable the built-in circuit substrates to be connected in parallel; a high-temperature-resistant insulating layer wire is separately led out of the plastic casing with the built-in circuit structure to serve as a positive electrode, and the silica gel is integrally fixed in a chip area on the periphery of the cylinder. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022028022-A1 |
| priorityDate | 2020-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.