http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111074281-B
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B5-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06 |
filingDate | 2019-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-111074281-B |
titleOfInvention | Chemical mechanical polishing composition and method for tungsten |
abstract | Compositions and methods for chemical mechanical polishing a substrate comprising tungsten to at least inhibit corrosion of the tungsten. The composition comprises as initial components: water; an oxidizing agent; selected fatty amine ethoxylates; dicarboxylic acids, iron ion sources; a colloidal silica abrasive; and optionally, a pH adjuster; and optionally, a biocide. The chemical mechanical polishing method includes providing a chemical mechanical polishing pad having a polishing surface; creating a dynamic contact at an interface between the polishing pad and the substrate; and dispensing a polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; some of which is polished away from the substrate and inhibits corrosion of the tungsten. |
priorityDate | 2018-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.