http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111071987-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_42ee49a1b5c677380cabfbd994c05a4c |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate | 2019-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecc954b67851fc07c3a93b5797c26e10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7af3fae37aaf5fae1913e30e58bf9b5d |
| publicationDate | 2020-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111071987-A |
| titleOfInvention | Packaging method and packaging structure of MEMS sensor |
| abstract | The invention discloses a packaging method and packaging structure of a micro-electromechanical system sensor. The method includes the following steps: forming a first packaging electrode structure and a first capacitor electrode structure on the lower surface of the upper cover plate, and forming a first bonding structure on the lower surface of the first packaging electrode structure; A second package electrode structure is made corresponding to the first package electrode structure, and a second capacitor electrode structure is made corresponding to the first capacitor electrode structure; a conductive aluminum layer is made on the upper surface of the lower cover plate, and the conductive aluminum layer covers the second package electrode structure and the second capacitor. The electrode structure and the upper surface of the lower cover plate; the conductive aluminum layer is corroded to obtain an electroplating area exposing the second package electrode structure, the second bonding structure is electroplated in the electroplating area, and the conductive aluminum layer is removed; the first bonding The structure is aligned with the second bonding structure, and bonding packaging is performed. The technical solution of the present invention can solve the problem that the etchant preferentially corrodes the electroplated tin when corroding the electrode layer, which causes the package failure. |
| priorityDate | 2019-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.