http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111050495-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_604ad33d314ad45d3374606df7033e9f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4632 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83579c3413ede3ad57c2443c65a51ab7 |
| publicationDate | 2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111050495-A |
| titleOfInvention | The inner layer production method of multilayer thick copper plate |
| abstract | The invention provides an inner layer manufacturing method of a multi-layer thick copper plate, which comprises the steps of: obtaining a copper foil plate, and performing surface treatment on the copper foil plate; using a laser cutting method to perform graphic processing on the copper foil plate to form a pre-fabricated graphics; add a prepreg between two copper foil boards and stack them in sequence; perform vacuum heating and pressing to form a laminate. The invention adopts laser cutting copper foil, and the slit width is small, that is, the line spacing between lines is small; the laser cutting process does not need chemical etching, and the whole process is environmentally friendly and pollution-free; at the same time, the edge of the slit is smooth, and there is no side etching phenomenon of chemical etching. , which further enhances the coil's resistance to instantaneous current impact and increases the consistency of the product; filling the gap with resin during the copper foil cutting process can prevent the partial pattern from falling off and enhance the stability of the pattern. On the one hand, filling the gap of the pattern with resin in advance can reduce the number of layers of the prepreg during lamination and reduce the thickness of the finished product. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112533381-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111843184-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112533381-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113423179-A |
| priorityDate | 2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.