| abstract |
The invention discloses a high-temperature-resistant mica board adhesive, which includes component A and component B, wherein the raw materials in parts by weight of component A are as follows: 30-40 parts of ladder-type silicone resin, 5-40 parts of MQ silicone resin 19 parts, 1-5 parts of nano-silica dispersion liquid, 0.1-2 parts of coupling agent and 40-60 parts of organic solvent; the following parts by weight of component B are composed of raw materials: 20-50 parts of curing agent and 50- parts of organic solvent 80 parts, the present invention uses silicone resin as the matrix resin of the mica board adhesive, which has higher temperature resistance than the epoxy matrix resin used in the prior art. The carbon content in the resin structure is low, the phenomenon of smoking will not occur under high temperature conditions, the insulation performance is good, and the strength is high. |