http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111020649-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111020649-B |
| titleOfInvention | Leveling agent and preparation method thereof, electroplating solution and application thereof, electroplating method of circuit board and circuit board |
| abstract | The invention provides a leveling agent and a preparation method thereof, electroplating solution and application thereof, an electroplating method of a circuit board and the circuit board, and belongs to the technical field of circuit boards. The leveling agent comprises the raw materials with the structural general formula as And having Of the general structural formula or a non-nitrogen-containing substance of a glycol diglycidyl ether, R 1 To R 4 Represents H or C z H 2z+1 ，R 5 And R 6 Represents H or CH 3 . The leveling agent is beneficial to improving the macro and micro distribution of the plating layer, so that the thickness distribution of the plating layer is uniform, the hole filling quality of the blind hole is improved, and scratches are reduced. The preparation method comprises the step of polymerizing the raw materials, and the method is simple and easy to operate. The electroplating solution containing the leveling agent has the effect of the leveling agent and can be used for circuit board electroplating, integrated circuit electroplating and the like. The electroplating method of the circuit board, which comprises the step of electroplating the circuit board by using the electroplating solution, is simple and easy to operate, is beneficial to improving the hole filling and deep plating capability of the circuit board, and the obtained circuit board has better performance. |
| priorityDate | 2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.