| abstract |
The invention provides a compound for encapsulating film, an organic film encapsulating material and an encapsulating film. The compound for encapsulating film has the structure of formula I. The compound with the structure of formula I is resistant to plasma, and when it is assembled with the inorganic layer to form a packaging film, it can prevent the surface from being etched during the evaporation of the inorganic film, maintain a high flatness, and thus make the packaging film have a lower water vapor permeability. over rate. The organic film prepared by the compound having the structure of formula I with at least two light-curable or heat-curable acryl-based compounds and an initiator has high flatness. The WVTR of the encapsulation film is 2.8× 10-4 to 5.5×10-4 g / m 2 ·day ; the etching degree Ra after etching is the highest of 14.8 nm. |