Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6650825960572982e555862b0b795ef |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-1284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-162 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 |
filingDate |
2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70c226655f0d0d51d6d8a60913b33b6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76f1a9c956178f9fa5bd8cc6215697bd |
publicationDate |
2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-111002651-A |
titleOfInvention |
A kind of high frequency copper clad laminate and preparation method thereof |
abstract |
The invention relates to a high-frequency copper-clad laminate and a preparation method thereof, so as to solve the problems of complicated process and material pollution in the production process of the existing high-frequency copper-clad laminate. The high-frequency copper clad laminate includes a glue-coated copper foil and a prepreg, and the glue-coated copper foil and the prepreg are alternately stacked in sequence. The preparation method of the above-mentioned high-frequency copper clad laminate includes the following steps: cleaning up the steel plate, the bearing plate, the upper buffer pad and the lower buffer pad; placing the lower buffer pad in the middle position of the bearing plate, and then placing the steel plate on the lower buffer pad; Place the glue-coated copper foil on the center of the steel plate with the rough side up and lay it flat; place the prepreg and glue-coated copper foil alternately in turn according to the set number of layers, and then place the upper buffer on the prepreg and glue-coated copper foil. Put the steel cover on the center position of the machine; set the pressing program of the hot press; send the material into the hot press; start the hot press, and the hot press will be processed to high frequency according to the set parameters through vacuum, heating and hydraulic processes. Finished copper clad laminate. |
priorityDate |
2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |