| abstract |
The present disclosure provides a thermosetting composition, the cured product of which can have a low dielectric constant, a low dielectric loss tangent, high heat resistance, and excellent adhesion to resins. The thermosetting composition according to the present disclosure contains: an ethylene-propylene-diene copolymer (A); and an inorganic filler (B) that has been surface-treated by a surface-treating agent having a polymerizable unsaturated bond. |