http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110996522-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110996522-B
titleOfInvention Circuit board manufacturing method and circuit board
abstract The invention discloses a circuit board manufacturing method and a circuit board, wherein the method comprises the following steps: s1, providing a circuit board semi-finished product subjected to false pressing, wherein the circuit board semi-finished product comprises a bonded PET (polyethylene terephthalate) film, a prepreg and a daughter board; s2, performing CO2 laser drilling of blind holes on the circuit board semi-finished product; and S3, removing the residual glue at the bottom of the blind hole by adopting UV laser, and cutting part of the copper layer. According to the circuit board manufacturing method, the residual glue at the bottom of the blind hole of the incompletely cured prepreg is removed by utilizing a UV laser cold processing mode, so that the problems of board explosion caused by wet glue removal and board burning and incomplete glue removal caused by dry glue removal can be avoided, and the quality and the qualification rate of products are improved.
priorityDate 2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 13.