http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110964462-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B2013-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2207-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B13-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B13-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 |
| filingDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110964462-B |
| titleOfInvention | Single-component conductive adhesive stored and cured at normal temperature and preparation method and application thereof |
| abstract | The invention discloses a single-component conductive adhesive stored and cured at normal temperature, a preparation method and application thereof, wherein the conductive adhesive is prepared from the following raw materials in percentage by weight: 30-60% of silver powder, 5-15% of thermoplastic acrylic resin, 1-7% of toughening agent, 0.1-1.0% of silane coupling agent, 2-5% of thixotropic agent and 20-40% of organic solvent. The conductive adhesive prepared by the invention has the advantages that (1) the conductive adhesive is single-component; (2) the dispensing property is good, and no wire drawing is performed; (3) the product can be stored at normal temperature without refrigeration; (4) the curing agent can be cured at normal temperature without heating; (5) the adhesive force to various materials is strong; (6) the conductivity is good after curing; (7) the advantages of moisture and heat aging resistance, cold and heat alternating impact resistance and the like, and the method has simple process and high efficiency and can be applied to large-scale production. The single-component conductive adhesive stored and cured at normal temperature can be effectively used for conducting upper glass and lower glass of a liquid crystal display screen, resisting static electricity of a fingerprint module, repairing breakpoints of various conductive circuits and the like. |
| priorityDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.