http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110964444-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110964444-B |
| titleOfInvention | Low-temperature fast-curing high-strength high-temperature-resistant acrylic adhesive and preparation method and application thereof |
| abstract | The invention discloses a high-strength high-temperature-resistant acrylic adhesive patch capable of being rapidly cured at low temperature and a preparation method thereof, wherein the adhesive patch is prepared from the following raw materials in percentage by weight: 15-25% of epoxy acrylate, 2-8% of MQ type silicon resin, 5-13% of reactive diluent, 0.2-0.5% of silane coupling agent, 52-72% of filler, 0.5-0.8% of initiator and 2.0-4.0% of red pigment. The patch adhesive prepared by the invention fully exerts the characteristic of low-temperature and rapid curing of free radicals of acrylic ester, can effectively inhibit the problem of oxygen inhibition of the acrylic patch adhesive by adding MQ type silicon resin, and can improve the high-temperature resistance of the patch adhesive while improving the crosslinking density; through the brand new combination of the epoxy acrylate, the MQ resin, the reactive diluent and the initiator, the cured surface mount adhesive has the bonding strength which is comparable to that of the epoxy resin surface mount adhesive. Meanwhile, the invention has simple production process and high efficiency and can be applied to large-scale production. |
| priorityDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.