| abstract |
A circuit board includes a base layer, a first conductive circuit layer and a second conductive circuit layer forming opposite sides of the base layer, the first conductive circuit layer includes a plurality of first conductive circuits, the second conductive circuit layer The conductive circuit layer includes a plurality of second conductive circuits, the circuit board further includes at least one through hole, a plurality of conductive lines distributed at intervals are embedded in the inner wall of each through hole, and each conductive line is electrically connected to one of the first conductive lines and one of the second conductive lines. The present invention also provides a manufacturing method of the above circuit board. |