http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110943052-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14698 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2019-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110943052-B |
| titleOfInvention | Chip package and method of making the same |
| abstract | The present invention provides a chip package and a manufacturing method thereof. The chip package includes a base, a first conductive structure and an electrical isolation structure. The base has a first surface and a second surface opposite to the first surface, and has a first opening and a second opening surrounding the first opening. The substrate includes a sensing device located therein adjacent to the first surface. The first conductive structure includes a first conductive portion within the first opening of the substrate and a second conductive portion above the second surface of the substrate. The electrical isolation structure includes a first isolation portion located in the second opening of the substrate and a second isolation portion extending from the first isolation portion between the second surface of the substrate and the second conductive portion, wherein the first isolation portion surrounds the first isolation portion. a conductive part. |
| priorityDate | 2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 |
Total number of triples: 28.