| abstract |
In an embodiment, the package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; a bottom a filler disposed under the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill to seal A first portion of the encapsulant is physically disposed between the first integrated circuit device and the second integrated circuit device, and the first portion of the encapsulant is flush with the edge of the underfill and the edge of the first integrated circuit device and the second integrated circuit device of. Embodiments of the invention also relate to integrated circuit packages and methods of forming the packages. |