http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110938848-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110938848-B |
| titleOfInvention | Composition for electrolytic deposition of copper and acid copper electroplating solution |
| abstract | The invention discloses a composition for electrolytic deposition of copper and acid copper electroplating solution, which comprises the steps of mixing polyamine compounds and thiourea chemicals, carrying out deamination polymerization reaction at a set temperature, and adding an alkylation or protonation modifier for chemical modification to obtain a modified composition, wherein the mixing molar ratio of the polyamine compounds to the thiourea chemicals is 1: 10-10: 1, the molar amount of the alkylation or protonation modifier is 0.01 to 10 times that of the polyamine compound. The invention relates to an acidic copper electroplating additive with good leveling property, and the acidic copper electroplating solution can deposit a flat copper layer and can fill micro blind holes without forming defects. |
| priorityDate | 2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.