http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110938847-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2019-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110938847-B |
| titleOfInvention | Copper electroplating leveling agent, preparation method thereof and electroplating solution |
| abstract | The invention provides an electroplated copper leveling agent, a preparation method thereof and an electroplating solution, wherein the electroplated copper leveling agent is polyheterocyclic ammonium salt. According to the copper electroplating leveling agent disclosed by the embodiment of the invention, a basic solution (namely a basic electroplating liquid medicine), an accelerator and an inhibitor are matched, and the through holes with the diameters of 150-250 um and the through holes with the depths of 800-1200 um are electroplated and filled with current density of 2.0-3.0 ASD, so that the full copper filling can be finally realized, and no defect exists in the through holes. |
| priorityDate | 2019-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.