| abstract |
The invention discloses a two-component organosilicon potting glue and a preparation method thereof, comprising a component A and a component B. The component A contains 25-50 parts of vinyl-containing high molecular weight polydimethylsiloxane, 150-200 parts of vinyl-containing low molecular weight polydimethylsiloxane, 500-600 parts of modified thermally conductive filler, 50-80 parts of nano-reinforced filler, 0.1-2 parts of catalyst, and 1-5 parts of coupling agent; Component B includes 15-30 parts of vinyl-containing high-molecular-weight polydimethylsiloxane, 80-120 parts of vinyl-containing low-molecular-weight polydimethylsiloxane, 100-150 parts of hydrogen-containing silicone oil, modified 400-500 parts of thermally conductive fillers, 0.1-10 parts of inhibitors, and 1-5 parts of coupling agents. The thermal conductive silicone potting compound of the present invention prolongs the operation time by the amount of the catalyst, improves the thermal conductivity by adding the modified thermal conductive filler, and improves the physical properties of the cured product by adding the nano-reinforced filler. |