http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110923757-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate | 2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110923757-B |
titleOfInvention | A kind of cyanide-free alkali copper electroplating solution and using method thereof |
abstract | The invention belongs to the technical field of electroplating, and in particular relates to a cyanide-free alkali copper electroplating solution and a method for using the same. The cyanide-free alkali copper electroplating solution comprises 5-8g/L of divalent copper ions, 75-85g/L of citrate, 15-25g/L of auxiliary complexing agent, 25-35g/L of conductive salt, and 8-8g/L of pH adjusting agent 15g/L, brightener 0.5-1.5g/L, wherein the auxiliary complexing agent is a mixture of organic amine compounds and polyhydroxycarboxylic acid compounds. By optimizing the complexing agent, the copper plating solution obtained in the present invention will not precipitate copper powder during the electroplating process, thereby improving the electrodeposition speed of electroplating copper, and the obtained coating is fine and uniform, with good coating adhesion, and can be electroplated on steel, yellow Various castings such as copper, aluminum alloy and zinc die castings are beneficial to industrial production. |
priorityDate | 2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.