| abstract |
A package structure and a method for forming the same are provided. The package structure includes a dielectric layer on the die, a redistribution structure, and conductive terminals. The rewiring structure includes a rewiring layer in and on the dielectric layer. The redistribution layer includes a via and a conductive plate. Vias are located in the dielectric layer and pass through the dielectric layer to connect to the die. Conductive plates are located over the vias and the dielectric layer and are connected to the die through the vias. The conductive terminals are electrically connected to the die through the redistribution structure. The through hole is annular. |