| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4af0df9a26ff4aafde7285cbd8eb12f4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0517 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G9-0821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G9-087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G9-087 |
| filingDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3fa2d32a00d4be5874f236443b57a12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42f0fe018e53cddd80ffe25dd79f9d1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3514ee2e65a5407b1f9ab8987eedf01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e611301b3cee35cfca95a3235be0b330
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e72812f3e7e3f8c8fc161a387b0dafa6 |
| publicationDate |
2020-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110896595-A |
| titleOfInvention |
Method and apparatus for manufacturing wiring board, and method for manufacturing integrated circuit |
| abstract |
The invention provides a method and an apparatus for manufacturing a wiring board having wiring with excellent resistance stability, and a method for manufacturing an integrated circuit. A method for manufacturing a wiring board, comprising: a preparation step of preparing a substrate on which a toner image of thermoplastic toner is formed; and a wiring forming step of forming a conductive foil having a thickness of 0.1 μm or more and 2 μm or less on the toner image formed on the substrate, and then forming a wiring made of the conductive foil by applying heat to at least the toner image and the conductive foil. |
| priorityDate |
2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |